Assembly line


Assembly


In today’s competitive electronics markets, there is simply no margin for error. You must meet design cycle requirements – on time and on budget, regardless of the challenges you face. At NBS, our integrated manufacturing model skillfully manages the multiple touch points involved in NPI. Using this proven expertise, we manufacture complex PCBs on a low to medium volume, quick turn basis.



Right first time. Every time.


At NBS, we know that people really do make a difference. This philosophy is evident across our assembly operations where highly skilled and experienced operators apply their in-depth knowledge of the industry to meet our goal of zero defects.


Using the very latest assembly technologies and processes, our advanced manufacturing solutions are built to be right first time, every time.


But don’t just take our word for it, why not see for yourself? Click here to arrange an appointment to visit our headquarters in California.


To give you a better idea of how we can help your business, we’ve outlined some of our leading-edge process and packaging capabilities below:



Process


  • Surface Mount Technology (Paste and Epoxy)
  • Intrusive Reflow
  • Through Hole
  • Wave/Selective Wave Soldering
  • Press Fit
  • Double/Single-Sided Reflow Processing
  • Rework and Repairs (Fine Pitch QFP, Area Array Packages)
  • Lead-Free Assembly
  • Water Soluble and No-Clean Processes

Packaging


  • 01005s
  • BGA and Micro BGA
  • CCGA
  • CSP and Flip Chip
  • 0.4mm Fine Pitch Devices
  • Mictor Connectors
  • Fine Pitch High Pin Count Press Fit Connectors
  • Via-in-Pad
  • Multi-Layered PC Board (24 layers)
  • Various PCB surface finishes (HASL, ENIG, Silver Immersion, OSP)